Industry 04
Semiconductors and electronicsPrecision beyond conductive materials.
Cut ceramics, silicon, PZT, FR4, copper and layered electronic materials without depending on electrical conductivity or adding heat.
Why Finecut
When the process must protect the part.
Electronic and semiconductor-related components often combine brittle, conductive and insulating layers. Finecut offers one cold process for contouring, singulation and feature creation across these mixed material systems.
Mixed stacks
Process metals, ceramics, polymers and fibre-reinforced laminates without changing cutting technology.
Functional layers
Avoid melting, smearing and thermal influence near electrically or mechanically active surfaces.
Flexible batches
Move from development quantities to repeatable production without dedicated hard tooling for every contour.
Applications built around the requirement.
Every application is qualified against the actual material, thickness, geometry, tolerance, edge-quality target and production volume.
Technical ceramics
Precision contours in alumina, zirconia, silicon carbide and insulating substrates.
Electronic materials
Cut FR4, copper, PZT and layered structures with a process independent of conductivity.
Packaging and fixtures
Produce intricate carriers, masks, brackets and support components in metals, polymers and composites.
Configure the complete system
Start with the part. Select the motion next.
Small radii, slots and precision outlines in flat substrates and components.
Application-specific piercing routines reduce risk when entering brittle or layered material.
Locate existing features and verify setup before cutting.
IGEMS prepares the cutting path while Finesoft controls execution, monitoring and repeatable job settings.
Proof, not assumptions
Validate before you scale.
Micro abrasive waterjet can produce complex geometries in brittle sintered material without thermal spallation or dependence on conductivity.
Performance depends on the complete application. Finepart uses test cutting and application engineering to define a credible process window and the right Finecut configuration.
Explore micro-scale applications ↗Your application
Bring the difficult part.
Send a drawing, material specification, thickness, tolerance and production target. Finepart will review the geometry and propose the next technical step.
Request a test cut ↗